Special Printed Circuit Board Manufacturing - Through Hole Resin Filled Board (PAD ON HOLE)
This is a substrate with resin embedded in the through holes and pads placed on top of it.
This is a circuit board designed to secure mounting space for components by embedding resin into through-holes and providing pads on top. With the trend towards narrower pitches for components such as BGA and CSP, the demand has increased. Resin and metal paste are embedded using vacuum printing. For more details, please contact us or refer to the catalog.
- Company：ケイツー
- Price：Other
